Custom Backplanes

Need passive, active or high-bandwidth backplanes? How about RF, design and engineering services and expertise? Maybe quickturn and prototyping capabilities?

At Sanmina-SCI we’re ready and prepared to be quick and meet all your backplane needs. Our world-class backplane services and global operations help you gain a competitive advantage in bringing new products to market quickly while reducing cost.

Distinguishing features that help you stay competitive include:

• Up to 60 layers
• Multiple surface finishes
• High-speed laminates and mixed-material composites
• Aspect ratios greater than 20:1
• Board thickness from 0.062” to 0.450”
• Dedicated SMT lines
• Electrical test and development
• DFx feedback
• 100% clamshell net testing
• Signal-integrity modeling
• High-speed 10Gps leadership through innovative engineering
• Panel sizes up to 31” x 52” assembly capability

Stay competitive. Be innovative. Partner with the best. For more than 25 years, we’ve been working with leading technology companies delivering high-quality and flexible backplane solutions.

Sanmina-SCI knows backplanes . . .

Clamshell testing. High-speed laminates. High-layer counts. Oversized panel production. On-board placements of active devices. These are just few examples of our expertise and deep technology knowledge.

Expertise. We have more than 400 engineers and 15 design centers strategically located around the world to assist in your next project. We're right there from the beginning earning your trust and impacting your bottom line.

We help you design for manufacturability so you can save money!

• Project Design & Engineering Management – Design for manufacturability and assembly (DFM/DFA), regulatory agency requirements and NPI initiatives.
• Electrical Design – ECAD (PCB layout), high-speed engineering, signal integrity with patented technology such as ZBC™ and OptiVia™, selective PTH configurations, backdrilling, active/passive components (SMT/BGA) and press-fit connector systems.
• Physical Design – Mechanical, power distribution and thermal integration.

If you're looking for a cost-effective way to quickly expand your market share and profits, look to Sanmina-SCI for the technology, expertise, global footprint and responsiveness you need.

Sanmina-SCI Backplane Technologies

Buried Capacitance®
With the continuous trend to smaller feature sizes and faster signal speeds, embedded passives are becoming more cost-effective solutions for improved signal integrity.

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Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials
Dicy-cured FR-4 materials have been used for decades to mount electrical components to PCBs.

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Backdrilling and Blind Via Formation
Backplanes and other thick-format boards can endure significant signal integrity (SI) disturbances as a result of the unused portions of through-holes and vias that extend past their last connected layer.

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Dk and Df Studies for Advanced Signal Integrity
When studying dielectric constants (Dk) and dissipation factors (Df), it is critical to use a single scaling system.

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Opti-Via™ Technology for Improved Signal Integrity at High Frequencies
Opti-Vias™ are a family of engineered via structures whose S-parameters have been optimized for high-frequency applications.

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Buried Capacitance® Laminator List

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For more information on Sanmina-SCI End-to-End solutions, Inquire Here!